Go back


This Powder Coating Masking tape is designed for clean, reliable performance. It can be used for splicing, e-coating, anodizing, photosplicing (powder coating).


  • Total thickness60 Micron
  • Backing thickness25 Micron
  • Adhesion strength3,3 N/cm
  • Tensile strength70,5 N/cm
  • Elongation at break120%
  • Temp. resistance180˚C (up to 204˚C)
Contact us Download PDF

Other products you might be interested in

A quotation or product question? Contact us
error: Content is protected !!